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Hitex

Automated Mutation Testing of Embedded Software: How good are your test cases?

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Mutation testing checks the quality of your test cases. Automated mutation testing is the most important new functionality in the new main version V4.3 of TESSY, the tool for automated unit / module and integration testing of embedded software. What is the purpose of such code mutations and how does mutation testing...

Published: Mar 02, 2021
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Intersil

How to Improve DC/DC Converter Performance with Phase Shifting Time Delay

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This article examines how to synchronize multiple DC/DC buck regulators in a Master/Slave configuration using phase shift time delay. Phase shifting multiple converters prevents ON time overlapping and reduces RMS current, ripple and input capacitor requirements, which will improve system EMI and power efficiency. This...

Published: Jul 20, 2018
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XMOS

Just Talk! Voice Controllers for the Internet of Things

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In less than a decade, tens of billions of electronic devices will be connected to the Internet-of-Things (IoT), a vast infrastructure of smart products that represent tens of thousands of different applications. Each of us will typically interact with hundreds of devices every day in order to control and monitor systems...

Published: Jul 19, 2018
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Renesas Electronics Europe

RS-485 Transceiver Tutorial

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This in-depth white paper guides you through the choices and weighs key design considerations to help you pick the right transceiver. It reviews the most typical RS-485 ICs and explore the most common design considerations. Then it examines electrostatic discharge (ESD) protection and compare the Human Body Model (HBM)...

Published: Jul 17, 2018
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Lattice Semiconductor Corporation

Implementing Video Display Interfaces Using MachXO2 PLDs

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Lattice Semiconductor has developed a display interface in the MachXO2 PLD family. Because this interface is now supported in MachXO2 devices, designers have an even lower cost and very low power alternative to implement embedded displays. This whitepaper provides an overview of this display standard and explain...

Published: Jul 19, 2018
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Taiyo Yuden

Material Advances Enable New Generation of Power Inductors

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Designers building power inductors for today’s highly volume mobile markets face a difficult dilemma. On the one hand the market demands higher performance systems with additional functionality running at higher current levels. On the other hand it pressures product designers to squeeze that additional functionality...

Published: Jul 20, 2018
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Vicor Corporation

Factorized Power Architecture and VI Chips

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As electronic systems continue to trend toward lower voltages with higher currents and as the speed of contemporary loads continues to increase, the power systems designer is challenged to provide small, cost effective and efficient solutions that offer the requisite performance. Traditional power architectures cannot,...

Published: Jul 25, 2018
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Sick Sensor Intelligence

Functional Safety for Machine Controls

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When implementing technical protective measures (also referred to as “safeguards”) from the hierarchy of controls, as discussed in Part 3 of this series (The Risk Reduction Process Utilizing a Hierarchy of Controls), each risk reduction measure will be associated with a safety function or combination of safety...

Published: Jul 17, 2018
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Lattice Semiconductor Corporation

SOLVING INTELLIGENCE, VISION & CONNECTIVITY CHALLENGES AT THE EDGE WITH ECP5™ FPGAs

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This whitepaper will introduce the ECP5™ and LatticeECP3™ FPGAs as viable solutions to overcome embedded design co-processing and connectivity challenges, and highlight application examples at the edge in industrial, consumer, automotive and machine learning areas, where these FPGAs solve the above mentioned...

Published: Jul 17, 2018
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Aavid

ENHANCED BOILING HEAT TRANSFER BY SUBMERGED ULTRASONIC VIBRATIONS

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This paper describes a new two-phase cooling heat transfer cell based on a submerged vibration-induced bubble ejection process in which small vapor bubbles attached to a solid surface are dislodged and propelled into the cooler bulk liquid. This ejection technique involves forcibly removing the attached vapor bubbles with...

Published: Jul 20, 2018
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Renesas Electronics Europe

White Paper 1: The Need for Security

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With the recent rise of the Internet of Things (IoT), 14 billion devices are now connected. However, the growth of this is also significant, by 2020 it is predicted that over 50 billion devices will be connected. With these devices connected, systems are opened up for remote access and control. In turn, this has shown...

Published: Jul 17, 2018
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National Instruments

Engineer’s Guide to 5G Semiconductor Test

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This Whitpaper paper focuses on the new challenges of testing semiconductor devices for wideband 5G applications.The enhanced mobile broadband (eMBB) use case points to supporting greater user data rates and increased system capacity. Departing from legacy 3G and 4G cellular standards, ...

Published: Nov 04, 2019
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Rutronik Elektronische Bauelemente GmbH

Electronic Design Security Aspects & Challenges

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Adding security to a device costs extra money, time, power consumption and makes everything worse. The only reason for adding security to a device is the need to improve marketing – security components help to sell more products. To participate in the evolution of Industry 4.0, the Internet of Things and cloud technologies...

Published: Sep 21, 2020
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Efficient Power Conversion Corporation (EPC)

eGaN® FETs in High Frequency Resonant Converters

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In this white paper eGaN FET technology is applied in a high frequency resonant converter. Previously, the advantages provided by eGaN FETs in hard switching isolated and non-isolated applications were addressed. This paper will demonstrate the ability of the eGaN FET to improve efficiency and output power density...

Published: Jul 24, 2018
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