Silicon carbide diodes have been around for some time now but have had little take-up in power supplies due to their relatively high cost. XP Power has recently adopted a silicon carbide (SiC) diode for the first time in the design of its latest family of modular, configurable power supplies known as fleXPower.
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Published: Jul 23, 2018
Though they seem like minor components on a smartphone, automotive dashboard or other consumer electronic device, tactile switches have the ability to influence perceptions of quality. True or not, a bad switch equals a bad device in the minds of many consumers.
So selecting the right switch really can be crucial...
Published: Jul 24, 2018
Ethernet seems to be one of the fastest growing transmission protocols ever, on both medium types, fiber and copper. Over fiber it easily reaches 40G and 100G transmission speed but in the future it may achieve even 400G or tera-level speed.
Over copper, of course, much lower speeds are achieved and 1G Ethernet has...
Published: Jul 26, 2018
When considering gate drive requirements, the three most important parameters for eGaN FETs are (1) the maximum allowable gate voltage, (2) the gate threshold voltage, and (3) the “body diode” voltage drop.
eGaN FETs differ from their silicon counterparts because of their significantly faster switching...
Published: Jul 25, 2018
The present paper describes the operation of a small-scale VIDA heat transfer cell for cooling desktop microprocessors with particular emphasis on its operating characteristics and cooling capabilities. The effects of internal flow regulation and of geometry and surface characteristics of the heated surface on the cell...
Published: Jul 20, 2018
Changes in power supply design are rarely revolutionary. Rather, they are evolutionary and dependent upon a host of component and manufacturing technologies that, for the most part, develop at a modest pace. Moore’s law simply doesn’t apply to power supply design; if it did, a 200 W switcher the size of a thumbnail...
Published: Jul 23, 2018
Many moderate size Programmable Logic Device (PLD) designs, especially those in control plane applications, consist of a number of interfaces interconnected via an onchip bus to a microprocessor that may be on- or off-chip. Although each interface is often relatively simple, the task of building all the on-chip interconnections...
Published: Jul 19, 2018
Most engineers think of flat cable as inexpensive wiring that runs between computer peripherals. But not all flat cable is created the same. There is a special category of flat cable that excels in uses where space efficiency isn’t the only consideration. What’s called Extruded Flexx-Sil™ cable is designed...
Published: Jul 18, 2018
Multiple challenges arise with the implementation of Embedded SSD projects. Potential problems involve usage model variance and untraditional usage models. Another issue is the longevity and reliability of SSD under dynamic change given the various applications of SSDs. Furthermore, mistakes commonly occur in solution...
Published: Jul 23, 2018
Although not part of the PCI Express spec, nontransparent bridging is completely consistent with it and can support multiprocessor systems with only minimal software initialization efforts.
For PCI Express technology to realize its full potential as the interconnect solution for chip-to-chip and backplane switching...
Published: Jul 17, 2018
This white paper will explore the optimization of PCB layout for an eGaN FET based point of load (POL) buck converter, comparing the conventional designs and proposing a new optimal layout to further reduce parasitics.
The optimal layout will provide improved efficiency, faster switching speeds, and reduced device...
Published: Jul 25, 2018
Stratum 3 and Stratum 3E oscillators have two frequency stability specifications (Free Run and Holdover). Telcordia has somewhat defined a third requirement, Drift. The Drift requirement is not per say a Telcordia specification. However Telcordia suggests that the Drift be used for calculating the Holdover specification...
Published: Jul 17, 2018
This in-depth white paper guides you through the choices and weighs key design considerations to help you pick the right transceiver. It reviews the most typical RS-485 ICs and explore the most common design considerations. Then it examines electrostatic discharge (ESD) protection and compare the Human Body Model (HBM)...
Published: Jul 17, 2018
The explosive growth in Internet-connected devices, or the Internet of Things (IoT), is driven by the convergence of people, device and data across the web. Future growth will be strongly influenced by wearable technology as products transition from the laptop to the pocket to the body.
Activity trackers are leading...
Published: Jul 20, 2018